Lead-Free Medium-Temperature No-Clean Solder Paste

This is a lead-free medium-temperature no-clean solder paste, brand APS, MPN MC-258. Its alloy, Sn64Bi35Ag1, indicates a specific melting point suitable for medium-temperature soldering processes. This paste is used for joining electronic components without post-soldering cleaning, particularly in SMT.

Specifications

Alloy	Sn64Bi35Ag1

About welding & soldering

Lead-Free Medium-Temperature No-Clean Solder Paste is listed under Welding & Soldering — mig, tig, stick consumables, torches, filler and solder. Welding and soldering consumables encompass a range of materials essential for joining metals through heat. MIG (Gas Metal Arc Welding) consumables include solid wires, flux-cored wires, and shielding gases such as argon, CO2, or argon/CO2 blends.

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